| 摘要 |
The cooling device comprises at least one vaporisation receptacle 1 for an electrically insulating refrigerant liquid 3 to be vaporised, in indirect thermal contact with at least one semi-conductor surface 11, at least one element 2 for condensing the vapours of the refrigerant liquid communicating with the said receptacle, and high-power components 32 arranged inside the said cooling device. <IMAGE>
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