| 摘要 |
PURPOSE:To enhance the accuracy of aligning a through hole to a land by laminating resists for printing patterns on copper foils adhered on both side faces of a printed wiring board, then opening through holes at predetermined positions of the board, removing the burrs of the holes generated at the peripheries of the holes by etching, and then, printing and developing the pattern. CONSTITUTION:Resists 14 are laminated on copper foils 9 of a substrate 8 on both side faces of which the foils 9 are adhered. Then, through holes 10 are opened by a drilling machine at predetermined positions of the board, and burrs 11 of the holes of the foils 9 generated in case of opening the holes are chemically removed with a copper dissolving agent. Then, the interiors of the holes 10 are electrolessly plated to form bases 13 of through hole conductors. Then, the resists are exposed and developed in a state that pads of an art work film are aligned to the holes, and the resists of the part to be pattern- plated are removed. Thereafter, the parts from which the resists are removed are pattern-plated, and solder-plated, thereby forming lands 17 and a circuit pattern. |
