发明名称 EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
摘要 PURPOSE:To obtain the title composition excellent in thermal cycling shock resistance, heat resistance and moisture resistance, by mixing a polyepoxy compound with a novolac phenolic resin, an inorganic filler, a polyether sulfone and a cure accelerator. CONSTITUTION:100 pts.wt. polyfunctional epoxy compound (A) (e.g., novolac epoxy resin) is mixed with a novolac phenolic resin (B) of an unreacted monomer content <=0.5% in such an amount as to give 0.8-1.2 equivalents of OH groups per equivalent of the epoxy groups of component A, 50-80wt.% inorganic filler (C) (e.g., CaCO3), 0.1-15wt.% polyether sulfone (D) of a mean particle diameter of 1-100mum, 0.1-5 pts.wt. cure accelerator (E) (e.g., 2- methylimidazole) and, optionally, a colorant, a mold release, flame retardant, a coupling agent, etc., (F).
申请公布号 JPH01132651(A) 申请公布日期 1989.05.25
申请号 JP19870291355 申请日期 1987.11.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJIMOTO TAKAMITSU;KANEGAE YUZO;KITA SHUICHI;SHINODA ATSUKO;MORIWAKI NORIMOTO
分类号 C08L61/10;C08G59/00;C08L61/04;C08L63/00;H01L23/29;H01L23/31 主分类号 C08L61/10
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