发明名称 PROCEDE ET DISPOSITIF DE DECOUPE LASER
摘要 A laser cutting method using a cutting head (10) comprising a laser beam source (F) such as a carbon dioxide laser, and an oxygen feed nozzle (13). To cut thick products (1), e.g. made of a ceramic or iron-carbon alloy, a cooling fluid (19) such as water is delivered onto the surface of the product to be cut on the cutting head side thereof and a negative pressure of at least 0.25 bars relative to the pressure on the cutting head side is generated on the other side of said product. The negative pressure is generated, e.g., by means of a pressure-regulated suction chamber (20) in sealing engagement with the product surface. The method is useful for laser cutting thick products such as steel sheets having a thickness of 10-30 mm.
申请公布号 FR2743318(B1) 申请公布日期 1998.01.30
申请号 FR19960000177 申请日期 1996.01.04
申请人 LITECH SARL 发明人 PACARY GERARD
分类号 B23K26/14;B23K26/38 主分类号 B23K26/14
代理机构 代理人
主权项
地址