| 摘要 |
The invention relates to a method for fastening components on printed circuit boards (2) during the production of printed circuit board assemblies having a mixed-fitment of components, the printed circuit board (2) initially being passed over a solder wave, as a result of which those components which are provided with connecting wires are soldered. Subsequently, the temperature produced on the component side of the printed circuit board by the solder wave is raised by additional heat-producing means (3, 5) fitted above the printed circuit board (2), to the extent necessary for solder which is applied for fastening of surface-mounted components melts again. In consequence, repeated thermal stressing of the components is avoided and it is possible to fit components of different embodiments in one operation. <IMAGE>
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