发明名称 |
METHOD FOR BONDING SEMICONDUCTOR LASER ELEMENT AND APPARATUS THEREFOR |
摘要 |
A method for bonding a semiconductor laser element, wherein a laser chip (4) is mounted on a stem (1) and a driving electric power is supplied to the laser chip through members for mounting the laser chip so that the laser chip emits a laser light, then the direction of the laser light is examined, and position of the laser chip is adjusted, in a manner that the direction of the laser light becomes within a predetermined range, and subsequently the laser chip is bonded on the pedestal (2) upon detection of entering the direction in the range, by flowing a large current through in the pedestal (2). |
申请公布号 |
EP0259816(A3) |
申请公布日期 |
1989.05.24 |
申请号 |
EP19870113055 |
申请日期 |
1987.09.07 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YAMAMOTO, AKIHIRO;MAKINO, YUTAKA;KAINO, SHINJI |
分类号 |
H01L21/52;H01S5/00;H01S5/022 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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