发明名称 Gripping element
摘要 The invention relates to a gripping element for transferring plate-shaped workpieces, in particular printed circuit boards equipped with components. This transfer operation must take place in a vibration-free manner and by the shortest route. This occurs by means of a gripping element which is constructed in such a manner that, in a guide body (2) which is configured so as to have a U-shape and is fastened on a bottom plate (6) provided with a T-slot, a swivellable or rotatable clamping claw (1), the upper end (10) of which projects above the guide body (2), is guided, by means of transverse bolts (11, 12) on which restoring springs (9) engage, in connecting links. A plunger (13) which is likewise located in the guide body (2) and is provided with a further restoring spring (4) is movably mounted and, by means of pressure on the projecting end (10) of the clamping claw (1), is driven by the latter, by means of friction forces, as far as the beginning of the deflection of the clamping claw (1). At the same time, the plunger (13) is bent at its upper end (3) and the bent end (3) projects through a slot in the cover part of the guide body (2). The latter is guided together with the clamping claw by this means and by means of the T-shaped cutout in the bottom plate (6). <IMAGE>
申请公布号 DE3738167(A1) 申请公布日期 1989.05.24
申请号 DE19873738167 申请日期 1987.11.10
申请人 SIEMENS AG 发明人 BADTKE,DETLEF;BOCK,ERICH;LAMPRECHT,HEINZ;REHBERGER,KARL-HEINZ;SCHNEPF,JOSEF;SEITZ,WALTER
分类号 B25J15/00;B65G47/90;H05K13/00 主分类号 B25J15/00
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