| 摘要 |
The invention relates to a process for preparing moldings based on silicon oxycarbide, which comprises reacting a molding containing from 50 to 90 percent by weight of silicon oxycarbide having an average particle size of from 0.5 to 50 um with from 10 to 50 percent by weight of a silicone resin having the general formula [(CH3SiO)x(OR)y(OH)z]n, in which R is an alkyl radical having from 1 to 4 carbon atoms, x is in the range of from 1.4 to 1.5, y is in the range of from 0 to 0.08, z is in the range of from 0 to 0.08 and n is in the range of from 20 to 40, under a nonoxidizing atmosphere or in a vacuum at temperatures in the range of from 700 DEG to 1500 DEG C.
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