| 摘要 |
PURPOSE:To improve the strength of an etching resist film, by forming a photosensitive photoresit film by electrodeposition coating, performing heat curing after a pattern formation and utilizing the cured film as the etching resist film. CONSTITUTION:A copper-plated layer 2 is formed on the surfaces of an insulating base member 10 and a copper foil 1. By electrodeposition coating, a photosensitive photoresist film 8 is formed on the surface of the copper plating layer 2 and the wall surface of a through hole 9. A circuit pattern is formed on the photosensitive photoresist film 8, by exposure and development using a mask film. By heat curing, the photosensitive photoresist film 8 is made to act as an etching resist film for alkali etching resist liquid containing ammonia, the copper foil 1 and the copper-plated layer 2 are subjected to etching by the alkali etching resist liquid, and a pattern is formed. Then the photosensitive photoresist film 8 is eliminated, and a printed wiring board 11 is obtained. |
