发明名称 COOLING CONSTRUCTION OF INTEGRATED CIRCUIT
摘要 PURPOSE:To enable a printed-circuit board to be replace easily without temporarily interrupting a refrigeration medium by performing adhesion of a cold plate and an integrated circuit only with a plate spring and a simple plain plate. CONSTITUTION:A printed-circuit board 2 incorporating an integrated circuit at both surfaces is mounted between cold plate assemblies 7 including one set of opposing wave-shape plate springs 4 between plural cold plates 3 with a refrigeration medium flow path within the inside through a pipe 6 at a position corresponding to one row of integrated circuit. Also, a plain plate 5 is inserted between the upper and lower plate springs 4 so that the spring is pushed widely and the cold plate 3 is pressed toward the integrated circuit 1. Heat generated by the integrated circuit 1 is transferred to the cold plate 3 which is adhered to the integrated circuit by the plate spring 4 which was pushed widely by the plain plate 5. Also, when replacing the printed-circuit board 2, by pulling out the plain plate 5, the board can be easily replaced without any contact with the cold plate and integrated circuit by pulling out the plain plate 5.
申请公布号 JPH01128496(A) 申请公布日期 1989.05.22
申请号 JP19870286127 申请日期 1987.11.11
申请人 NEC CORP 发明人 KOMATSU TOSHIAKI
分类号 H01L23/40;H01L23/473;H05K7/20 主分类号 H01L23/40
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