| 摘要 |
PURPOSE: To reduce manhours for fabrication and secure the reliability for continuity by directly mounting an IC chip on one of the surfaces of each of chip mounting pieces on one of the end parts of each of leads on a metal lead frame with a specific linear expansion coefficient and at the same time, sealing these components into a molding resin. CONSTITUTION: The semiconductor IC device A is of such a construction that a chip mounting piece 5 is mounted on each of a plurality of leads 3, 3... on a metal lead frame 2 with a linear expansion coefficient of 3×10<-6> / deg.C-1.8×10<-5> / deg.C, then an IC chip 1 formed of a silicone wafer is directly mounted on one of the surfaces of each of the chip mounting pieces 5, and at the same time, the IC chip 1 is sealed into a molding resin 4 together with the leads 3, 3.... Consequently, it is possible to fix the IC chip 1 to the leads 3, 3..., then bring the IC chip into contact with the leads 3, 3... simultaneously, and reduce manhours for fabrication. Thus the linear expansion coefficient of the silicone wafer forming the IC chip 1 is approximate to that of a lead frame 2 and the difference in the expansion size between these components following a change in temperature is small. In addition, a spot in which the chip mounting piece 5 of the leads 3 on the lead frame 2 are joined with the IC chip 1 is not deviated and the reliability for continuity between the IC chip 1 and the leads 3 is ensured.
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