| 摘要 |
<p>PURPOSE:To connect an electrode for a semiconductor chip and a wiring pattern simply in place of a bump form, and to reduce process costs by forming an insulating film wider than the chip area of the semiconductor chip onto the wiring pattern of a circuit substrate. CONSTITUTION:A bored and worked insulating film 6 is placed onto a circuit substrate 2 on which a wiring pattern 4 is shaped by using conductive ink, and bonded onto the circuit substrate 2 through thermocompression bonding. A binder resin included into conductive ink is heat-fused and the insulating film 6 is fixed onto the wiring pattern 4, and heat-fused conductive ink intrudes into a hole 12 in the bored and worked insulating film 6 and is changed into a conductor 14. Anisotropic conductive adhesives 16 containing thermoplastic or thermosetting metallic particles are mounted at a required position on the circuit substrate 2 including the wiring pattern 4 while an electrode 10 for a semiconductor chip 8 is placed onto the wiring pattern 4 so as to be oppositely faced to the hole 12 in the insulating film 6. Accordingly, the conductor 14 and the electrode 10 are connected electrically.</p> |
