| 摘要 |
PURPOSE:To mold a resist layer to a specified pattern with high accuracy and excellent workability by forming the resist layer onto the whole surface on a printed board, printing the specified pattern through screen printing using light-shielding ink onto the surface of the resist layer and exposing and developing the whole. CONSTITUTION:A resist layer 3 composed of a photo-setting type resin is shaped onto the whole surface of a printed board 1 to which circuits 1a formed by pattern-molding a copper foil are annexed. Specified patterns 4 are printed and exposed onto the surface of the resist layer 3 through screen printing employing light-shielding ink, and resist layers 3a in sections through which light is transmitted are cured. Light-shielding ink on the resist layer 3 and resist layers 3b in sections not cured are removed through development, and solder resist layers molded to specified patterns are acquired. An etching resist layer is molded in such a manner that a copper foil is annexed onto the whole surface and the resist layer 3 is formed onto the copper foil. |
