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发明名称
RESIN SEALING OF ELECTRONIC ELEMENT
摘要
申请公布号
JPH01129424(A)
申请公布日期
1989.05.22
申请号
JP19870288064
申请日期
1987.11.15
申请人
OMRON TATEISI ELECTRON CO
发明人
SUGIMOTO SHUICHI;UEYAMA MASAKATSU
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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