发明名称 PACKING STRUCTURE FOR MICROWAVE INTEGRATED CIRCUIT
摘要 PURPOSE:To obtain a satisfactory high frequency characteristic by packing a microwave integrated circuit loaded on a carrier, in a reverse state to a case and taking the matching of a connection of an input/output terminal part of the microwave integrated circuit. CONSTITUTION:A microwave integrated circuit 1 is loaded on a carrier 30, and also, on a case bottom plate 11, a prescribed microstrip line 15 is provided, respectively, therefore, when the carrier 30 is fixed to a case 10 by using machine screws 21 in a state that the carrier 30 has been reversed and the carrier surface 32 has been set to the lower side, a strip conductor 4 being an input/output terminal part of the microwave integrated circuit 1 is stratified and adheres closely to the surface of the end part of a strip conductor 17 of the respective microstrip lines 15. Also, the carrier surface 32 adheres closely to the surface of the case bottom plate 11, respectively, and a ground conductor is connected. Accordingly, the impedance of the connecting part of the input/ output terminal part of the microwave integrated circuit 1 is always constant.
申请公布号 JPH01129502(A) 申请公布日期 1989.05.22
申请号 JP19870286902 申请日期 1987.11.13
申请人 FUJITSU LTD 发明人 SAKUMA KATSUMI
分类号 H01L23/12;H01P3/08;H01P5/08 主分类号 H01L23/12
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