| 摘要 |
<p>PURPOSE:To acquired a semiconductor device whose low cost construction an protect an IC by fixing an IC pellet in the rear side of a die island and by screening physical effect from the front side of the semiconductor device by the die island. CONSTITUTION:Granting that the rear side of a semiconductor device is the side whereon a lead 40 is connected to a printed board and the front side is the opposite thereof, an IC pellet 1 is protected against the physical effect from the front side of the semiconductor through a die island 2 by fixing the IC pellet 1 to the rear side of the die island 2. The IC pellet 1 of a resin-sealed flat package type semiconductor device can be thus protected against the physical effect from the front side of the semiconductor by this simple construction.</p> |
