发明名称 LEAD FRAME FOR CLEANING RESIN SEALING DIE
摘要 PURPOSE:To fill all the corners of the cavity with die cleaning resin and to enable die cleaning without failure by providing a large cut area including a cavity area where a die is filled with die cleaning resin and an air vent to escape air within the cavity area. CONSTITUTION:A die cleaning lead frame 10 is made larger than the outline of cavity areas 3 and 11 and cut off to near a pressure escape section 5. Die cleaning resin spreads in the entire region where the lead frame is cut including the air vent 4 to eliminate thin resin entered the air vent 4 together with cavity areas 3 and 11. Since the die cleaning lead frame 10 is cut off so that die cleaning resin can flow in the range of length L including the range of the cavity area and the air vent 4, thin die cleaning resin in the range of the air vent 4 flows in the thickness added the thickness of the die cleaning lead frame 10. Therefore, when eliminating die cleaning resin, die cleaning resin entered the air vent 4 can be eliminated together with the cavity area.
申请公布号 JPH01128439(A) 申请公布日期 1989.05.22
申请号 JP19870286397 申请日期 1987.11.11
申请人 FUKUOKA NIPPON DENKI KK 发明人 KOGA KATSUHIDE
分类号 H01L23/50;B29C45/26;H01L21/56;H01L23/48 主分类号 H01L23/50
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