发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To join a wire and a bonding surface stably, and to conduct wire bonding having excellent bondability by mounting a load control section installed to a rocking arm and changing and applying load applied to a bonding arm during bonding. CONSTITUTION:A wire-bonder control section 20 outputs a load command (a) at the time of bonding to a command changeover circuit 21. An underside detecting section 22 detects a contact with a bonding surface of a capillary at all the time at that time, and outputs a detecting signal to the command changeover circuit 21 when the capillary is brought into contact with the bonding surface, and the command changeover circuit 21 changes over the load command to the increase of a load value by the input of the detecting signal. A load value command (b) output from the command changeover circuit 21 is D/A converted by a D/A converter 23, the data is converted into a command having fixed delay by a low pass filter 24 and output to a constant current circuit 25, currents are stabilized by the constant current circuit 25, and an electromagnet 26 for load applies load to a wire bonding arm as the suction force of an electromagnetic solenoid on the basis of a stabilized current data.
申请公布号 JPH01129430(A) 申请公布日期 1989.05.22
申请号 JP19870289962 申请日期 1987.11.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 IKUTA YOSHIKAZU;OKAMURA MASAMITSU
分类号 H01L21/60 主分类号 H01L21/60
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