发明名称 MANUFACTURE OF INSULATING LAYER FOR CERAMIC MULTILAYER INTERCONNECTION BOARD
摘要 PURPOSE:To obtain excellent adhesion with a conductor layer and excellent insulating property at low costs, by manufacturing insulating layers having a double-layer structure by using the same insulating paste, and manufacturing the insulating layers having a substantially three-layer structure. CONSTITUTION:Insulating paste includes alumina powder, glass ceramics powder and an organic binder and has a viscosity of 500kcps. The insulating paste is applied on a conductor layer of a ceramic wiring board. With the applied surface facing upward, the device is baked at a temperature increasing speed of 100 deg.C/min or less. The glass ceramics component remains at the upper part, and the alumina component remains at the lower part. When the temperature reaches the crystallizing temperature of the glass ceramics component, the constant temperature is kept. The baking is performed until the position of each particle in the powder does not move. Thus, a first insulating layer 3 is manufactured. The same paste for baking the first insulating layer is applied on the ceramic wiring board 1. The device is turned inside out so that the applied surface faces downward. Baking is performed in the same baking profile as in the manufacturing of the first insulating layer. Thus, a second insulating layer 4 is manufactured. The first and second insulating layers 3 and 4 are sequentially laminated, and a double-layer structure is obtained.
申请公布号 JPH01128592(A) 申请公布日期 1989.05.22
申请号 JP19870286524 申请日期 1987.11.13
申请人 NEC CORP 发明人 INOUE HIROBUMI
分类号 H05K3/46;B32B18/00 主分类号 H05K3/46
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