| 摘要 |
PURPOSE:To easily and inexpensively manufacture a sputtering target having high bonding strength and superior cooling efficiency by disposing a powdered dielectric material on the mixture of powdered dielectric material and powdered metallic material and then subjecting the above to compacting and hot forming. CONSTITUTION:A powdered dielectric material is disposed on the mixture of powdered dielectric material and metallic material, which is subjected to compacting and hot forming. The above compacting and hot forming can be applied by carrying out hot pressing or cold isostatic pressing and then sintering. By this method, a sputtering target having an upper layer consisting of dielectric material and a lower layer consisting of dielectric material and metallic material can be obtained. This target has superior wettability between the above- mentioned lower layer and a metal and also has high bonding strength and superior cooling efficiency when bonded to a backing plate by means of the above metal. |
