| 摘要 |
PURPOSE:To stably manufacture a micro-sized MIM element by etching a part of the upper part of a metallic pattern to form a conductive thin film on the metallic pattern and forming this conductive thin film on the side face of the metallic pattern by etching. CONSTITUTION:A metallic pattern 3 is formed on a transparent insulating substrate 1, and a resist used for the formation of the metallic pattern 3 is used to form an insulating film 5 by the anodic oxidation of the side face of the metallic pattern 3, and thereafter, a part of the upper face of the metallic pattern 3 is etched to generate a step between the insulating film 5 and the metallic pattern 3. The boundary between the metallic pattern and the insulating film 5 of the conductive thin film pattern formed on the metallic pattern 3 is selectively removed by etching. Thus, pollution is prevented on the way of manufacturing process and the micro-sized MIM element having a nonlinear resistance characteristic is stably produced by an easy method requiring no special manufacturing devices. |
