| 摘要 |
PROBLEM TO BE SOLVED: To relieve the heat of a semiconductor element and noise directly to the open air or mounting board by exposing the back side of a semiconductor element mounting face of a semiconductor element mounting part out of an encapsulating resin. SOLUTION: At a semiconductor electric 1a the back side of a semiconductor element mounting face of a semiconductor element mounting part 2 is not covered with an encapsulating resin 7 but is made to be exposed out of the encapsulating resin 7. The down bond 8 is made to the semiconductor element mounting part 2 from a ground electrode of a semiconductor element 5, and the semiconductor element mounting part 2 is utilized as a ground. A high thermal conductivity Ag paste which is lean in solvent is used as an adhesive 5 for mounting the semiconductor element 5, and the stand-off is set in a range of 0.0508±0.0254 mm. Thus it is possible to relieve the heat of the semiconductor element well to the mounting substrate as well as the noise well to the mounting board and is made surely mountable, even if warpage in the semiconductor substrate is generated.
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