| 摘要 |
PROBLEM TO BE SOLVED: To provide fine wiring patterns on a surface and a back, by installing a plurality of connection holes for connecting the necessary parts of both faces of the patterns in an insulating film, filling the connection holes with conductive paste, and electrically connecting the wiring patterns of both faces. SOLUTION: For manufacturing a double face wiring film carrier tape, copper foils 2a and 2b are adhered to both faces of an insulating film 1. Liquid photoresist is applied and copper foil on both faces is patterned so as to form wiring patterns 3a and 3b. Connection holes 4a being through holes and holes for positioning are formed in necessary parts. The connection holes 4a are filled with conductive paste 5 and the wiring patterns of both faces are electrically connected. Then, solder resist 6 is applied to the prescribed areas of the wiring patterns and the connection holes 4a filled with conductive paste so as to protect them. Thus, the double face wiring carrier tape where the fine wiring patterns of not more than 100μm pitches exist on both faces can be mass-produced.
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