发明名称 METHOD FOR BONDING RESIN
摘要 <p>PURPOSE:To carry out close bonding without entry of moisture into bonded surfaces, etc., by blending a filler, such as glass fiber, in one of resins which are hardly compatible, molding the resins, removing the surface resin layer with flame treatment, etc., and filling another resin thereon. CONSTITUTION:A filler, such as glass fiber, which is readily compatible with one of different resins which are hardly compatible is blended in the other, filled is a given region and molded to carry out treatment of a surface bonded to the other resin with a chemical, plasma or flame, etc. The resin of thickness about several mu over 10- tens of mu is removed and the other resin is filled, molded and bonded to the treated surface.</p>
申请公布号 JPH01126339(A) 申请公布日期 1989.05.18
申请号 JP19870284241 申请日期 1987.11.12
申请人 NEW JAPAN RADIO CO LTD 发明人 UNNEN KUNIYUKI;KOGA MASANOBU
分类号 B29C65/70;B29K105/16;C08J5/12;C08J7/00;C08J7/12 主分类号 B29C65/70
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