| 摘要 |
PURPOSE:To improve tensile strength, bondability and moisture resistance of external leads in a resin mold by forming the stitch surface to be wire bonded perpendicularly to the bonding pad face of a semiconductor element to be placed on an island, and forming it at a position higher than the bonding pad face. CONSTITUTION:Each lead of a lead frame is so formed at a stitch face 3 formed from an external lead 1 through a flat plate lead 2 as to be substantially perpendicular to the bonding pad 4 of a semiconductor element. The element 6 is connected by bonding from a bonding pad 4 through a bonding wiring 5 to the face 3 disposed at a position higher by at least 0.5mm than the face of the pad 4. When the face 3 is so stood perpendicularly to the side edge of the lead 2 as to be perpendicular to the side face of the element 6, the length of the wiring can be increased, and the size of the element to be mounted can be increased. |
