| 摘要 |
<p>PURPOSE:To delete an inking step by providing a mechanism for indicating information as to a semiconductor wafer to a dicing device. CONSTITUTION:An adhesive seal 13 is adhered to the rear face of a dicing device 11, and a semiconductor wafer 14 is adhered to an adhesive seal 13 exposed with an opening 12. The seal 13 is so adhered to the upper part of the annular plate of the device 11 as to block a plurality of through holes 15 regularly arranged thereon, and through holes are opened only at the positions of predetermined holes 15. Thus, the ID code or the like of the wafer 14 is displayed. This code is read thereby to identify the wafer 14. Accordingly, after a semiconductor device is tested and measured, even if it is diced, a nondefective product can be identified. Thus, an inking is eliminated.</p> |
