| 摘要 |
PURPOSE:To mount semiconductor chips in high density by connecting the wiring face of the chip to the wiring face of a substrate to be connected thereto by forming an angle therebetween. CONSTITUTION:A semiconductor chip 11 is laterally disposed at its wiring face, and wirings 13 on a substrate 14 are aligned with a solder bump 12 formed on the chip 11. The bump reflows to electrically connect the chip to the substrate, an IC chip and a connection section are fixed with molding agent 15 and mounted. Thus, the chip is stood at an arbitrary angle on the substrate thereby to simply remove the short-circuit of the chip to the substrate and an excessive space, thereby obtaining the mounting structure of the chip in higher density with high reliability. |
