| 摘要 |
PURPOSE:To improve the accuracy within and between wafers by forming a pattern so as to enclose the prescribed pattern disposed in a central part and forming a slit in the prescribed pattern. CONSTITUTION:The pattern 1 is so disposed as to enclose the prescribed circuit pattern 2. The size of the pattern 1 and the space with the prescribed circuit pattern 2 are changed according to an exposing device, the kind of resists and the shape of the resists. The end faces of the resist can thus be formed round even in only the part within the circuit pattern simply by changing the circuit pattern on a mask. Since the operation under standard exposing conditions is possible, the working accuracy within and between the wafers is improved. |
