| 摘要 |
<p>PURPOSE:To make compact and lighten a leveling apparatus, by performing leveling operation by blowing out a gas so as to be in parallel with a predetermined reference surface and fixing a wafer chuck part, while holding the leveling state of its object. CONSTITUTION:The state of a wafer chuck part 15 is made floating to form an air bearing structure. Then, nozzles 11A, 11B an 11C come close to a wafer 2 and when a predetermined second clearance distance is attained, the operation of an air cylinder 10 is stopped. At the same time, air supply to an expansion body 12 of an air slide apparatus 18 is stopped and a slide 19 is fixed. At this time, each air for adjusting a level in which a blowout pressure is finely controlled by each of three nozzle pressure adjusting apparatuses 13A, 13B and 13C is blown out from each of three nozzles 11A, 11B and 11C to the wafer chuck part 15 in a floating state. The wafer chuck part 15 rotates along a spherical surface 16-1 of a flame part 16 such that the blowout pressure of the air for adjusting a level from the three nozzles 11A, 11B and 11C may be the same and the leveling operation of the wafer 2 is performed.</p> |
