| 摘要 |
This invention provides for increased precision position adjustment for carrier film supported micro-packs in which the carrier film has applied thereto a conductive pattern producing a contact array emminating from a function unit such as a microchip carried by the carrier film. Precise adjustment of the conductive pattern relative to the terminals of the function unit is provided for by arranging the carrier film as a film having the width of, for example, standard cinema film (35 mm), but however using the marginal film transport perforations of a miniature film (8 mm) and in addition providing two adjustment openings per contact array which have larger dimensions equivalent to the transport dimensions of the cinema film. |
