| 摘要 |
The terminals (24) of a mount carrying an electro-optic transducer are directly secured to terminals (19) of a lead-frame based integrated circuit dual-in-line package that protrude from one end of the package encapsulaton (18). The package includes drive circuitry for the transducer. The electro-optic transducer may be a light emitting diode or a photodetector. The transducer mount may be accommodated in the rear end of an optical fibre connector (40) and the whole protected by encapsulation (50). <IMAGE> |
