| 摘要 |
<p>PURPOSE:To feed a power supply to an LSI without using a pin by a method wherein the power supply is fed to an LSI chip mounted on a substrate through a lead wire from an LSI wiring pad. CONSTITUTION:A power-supply bus 3 used to feed a power supply is brought into contact with the upper surface of a metal cap 6 and is connected to the cap. One end of a conductor power-supply pattern 7 arranged on the surface of a substrate 5 is connected to the rear of the metal cap 6; the other end is connected to an LSI wiring pad 8a for power-supply feed use formed on the surface of the substrate 5. In addition, the LSI wiring pad 8a is connected to a power-supply feed position of an LSI chip 4 mounted on the substrate 5. As a result, the power supply of the power-supply bus 3 is fed to the LSI chip 4 of an LSI 1a without using a pin 10 attached to the substrate 5 and without using a power-supply layer 11 formed inside the substrate 5.</p> |
