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发明名称
MOLDING DIE FOR RESIN SEALING
摘要
申请公布号
JPH01124226(A)
申请公布日期
1989.05.17
申请号
JP19870282562
申请日期
1987.11.09
申请人
MITSUBISHI ELECTRIC CORP
发明人
HIGUCHI YUKIO;SHIMOTOMAI MASAAKI
分类号
H01L21/56;B29C45/14;B29C45/37
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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