| 摘要 |
PURPOSE:To manufacture a printed-circuit board whose thermal resistance and insulating characteristic are excellent and whose adhesion force with reference to a plated metal is high by a method wherein a nickel thin layer formed on a rough face of a metal-foil support body is laminated on an insulating organic material, the metal-foil support body is etched selectively, the nickel thin layer is left on the insulating organic material and a conductive metal is plated on this surface. CONSTITUTION:A nickel layer formed on the surface of a metal-foil support body such as copper foil or the like having a rough face of a microscopic uneven shape is formed with a uniform film thicknests along the rough face shape if the metal-foil support body. The metal-foil support body where the nickel layer has been formed and a resin are laminated; after that, a nickel thin layer together with the uneven shape of the metal-foil support body is transcribed onto the surface of a substrate where only the metal-foil support body has been etched and removed. A metal layer of a desired thickness is plated on this nickel thin layer and a circuit is formed; as a result, a printed-circuit board whose adhesion force with reference to a plated metal is high can be obtained. |
