发明名称 |
Curing oven system for semiconductor devices |
摘要 |
An automated curing oven system for use in the manufacturing of semiconductors. This system may easily be incorporated with other automated machinery used for various semiconductor processing steps because it employs the same device holding magazine used for many other steps. The device holding magazine serves as the oven chamber itself thereby eliminating many manual handling steps.
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申请公布号 |
US4830609(A) |
申请公布日期 |
1989.05.16 |
申请号 |
US19880205887 |
申请日期 |
1988.06.13 |
申请人 |
MOTOROLA, INC. |
发明人 |
LANINGA, ALBERT J.;BAXTER, MARJORIE S. |
分类号 |
H01L21/31;F27D5/00;H01L21/56 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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