发明名称 MANUFACTURE OF RESIN SEALED ELECTRONIC PART
摘要 <p>PURPOSE:To restrict the occurring region of any resin flash to the parts near a resin sealed body by a method wherein two grooves are formed along almost full width length in the width length direction of an outer lead to force-fit a liquefied sealing resin in a molding cavity for setting. CONSTITUTION:An irregular holding surface 22 taking at least two V-sectional shape comprising a first groove 23 and a second groove 24 going across in the width length direction of a lead 5 is formed on one main surface 5a of the outer lead 5. The lead 5 is arranged in an outer lead fitting groove 19 provided in a bottom force 13 while the irregular holding surface 22 of the lead 5 is held by a top force 12 and the bottom force 13. A melted resin is force-fitted in a molding cavity 14 formed in a molding die 11 to mold the resin sealed body. At this time, the melted resin leaking out of the cavity 14 along the main surface 5a of the lead 5 is trapped in the groove 23. Through these procedures, the occurring region of any resin flash can be restricted to the parts near the resin sealed body.</p>
申请公布号 JPH01123447(A) 申请公布日期 1989.05.16
申请号 JP19870280306 申请日期 1987.11.07
申请人 SANKEN ELECTRIC CO LTD 发明人 YOKOYAMA TAKAAKI
分类号 H01L23/48;H01L21/56 主分类号 H01L23/48
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