发明名称 |
Photocurable composition |
摘要 |
A photocurable composition comprising (1) an epoxy compound having at least one epoxy group and at least one unsaturated double bond in the same molecule; (2) a metal compound present in an amount ranging from 0.001 to 10 wt. %, based on the epoxy compound; and (3) a silicon compound which is capable of forming a silanol group when irradiated with light and which is present in an amount ranging from 0.1 to 20 wt. %, based on the epoxy compound, is characterized by a particularly rapid curing rate.
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申请公布号 |
US4831063(A) |
申请公布日期 |
1989.05.16 |
申请号 |
US19870018834 |
申请日期 |
1987.02.24 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SUZUKI, SHUICHI;WADA, MORIYASU;HAYASE, SHUZI |
分类号 |
C08G59/00;C08F2/48;C08F2/50;C08F299/02;C08G59/18;C08G59/20;C08G59/40;C08G59/68;C08G65/14;C08G65/22;C08G65/26;C09D11/00;C09D11/10;C09D163/00;C09J163/00;G03F7/004;G03F7/027;G03F7/038;G03F7/075 |
主分类号 |
C08G59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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