| 摘要 |
PCT No. PCT/SE89/00130 Sec. 371 Date Aug. 20, 1990 Sec. 102(e) Date Aug. 20, 1990 PCT Filed Mar. 13, 1989 PCT Pub. No. WO89/08539 PCT Pub. Date Sep. 21, 1989.A method of manufacturing chipboard having a central layer of coarse chips and two outer layers of chips whose fibers are oriented in the plane of the board. The central layer is formed by using as chips therefor end-grain cut flake-like chips, the fibers of which are oriented in the direction of thickness of the chips, so that the chip fibers in the central layer are oriented substantially transversely to the plane of the board. The chipboard thus formed has low swelling with moisture and relatively light weight for its strength. Such chipboard also has relatively high bending strength and transverse strength. |
