| 摘要 |
A unitized packaging arrangement for an energy dissipating device comprises a thermoplastic housing, base, and cap which are joined together to form the package for the device. The thermoplastic housing is formed to mountably receive the energy dissipating device and is provided with a metallized conductor pattern on portions of its outer surface. The conductor pattern is connected to a plurality of bonding pads on the device. In a preferred embodiment, the conductor pattern includes the metallized surface of at least one opening formed in the thermoplastic housing. In an especially preferred embodiment, a conductive element (such as a conductive pin) is located in the opening and is joined to the metallized surface by soldering. The thermoplastic base is formed to mountably receive the thermoplastic housing following mounting of the device, and provides access to the conductor pattern from outside the packaging arrangement. In a preferred embodiment, at least portions of the interior surfaces of the base and cap, and matching portions of the exterior surfaces of the thermoplastic housing, are metallized and pre-tinned with solder. The housing, base and cap are then joined by a metal-to-metal bonding technique, such as reflow soldering. In addition to providing a mechanism for mechanically bonding the components of the packaging arrangement together, the metallized surfaces provide barriers to the ingress of moisture to the area surrounding the device, and provide a mechanism for regulating the flow of heat from the device.
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