| 摘要 |
<p>PURPOSE:To accurately dispose a semiconductor chip at a predetermined position on a substrate by providing a positioning mark to be optically detected in a hanging state from a rear face. CONSTITUTION:In a semiconductor chip 12 disposed in a positioning state on a substrate, an optically detectable positioning mark 16 is formed in a hanging state from its rear face. That is, the mark 16 is detectable in a state that the chip 12 is hung. Accordingly, even after the chip 12 is hung, the position of the mark 16 of the chip 12 can be detected. Thus, the chip 12 can be accurately disposed at a predetermined position on the basis of the position of the mark 16.</p> |
