发明名称 CURABLE COMPOSITION
摘要 <p>A radiation curable composition for an adhesive includes a polyurethane, for example a polyurethane comprising residues of a polyether diol or a polyester diol, capped with residues of a hydroxyalkyl acrylate or methacrylate and non-polymerisable residues of a primary or secondary alcohol. The compositions may be cured to form a pressure sensitive adhesive and can be employed to produce adhesive dressings by coating a suitable substrate with the composition and thereafter curing the coated composition by, for example, electron beam or ultra violet irradiation.</p>
申请公布号 JPH01121381(A) 申请公布日期 1989.05.15
申请号 JP19880214736 申请日期 1988.08.29
申请人 SMITH & NEPHEW PLC 发明人 KURISUTOFUA UIRUSON GAI ANSERU;KOORIN BATORAA
分类号 C08G18/80;A61L15/58;A61L24/04;A61L31/06;C08F2/46;C08G18/10;C08G18/67;C09J175/00;C09J175/16 主分类号 C08G18/80
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