| 摘要 |
PURPOSE:To prevent short circuits among each terminal due to the outflow of solder from adjacent terminal sections at the time when leading-out terminals and connecting terminals are bonded through heating and pressing by interposing a spacer composed of nonconductive powder between a substrate and a flexible wiring board. CONSTITUTION:Nonconductive spacers 6 are held between a flexible wiring board 4 (FPC) and a substrate 1 while leading-out terminals 2 on the surface of the substrate 1 and connecting terminals 5 on the surface of the FPC 4 are laminated so that positions thereof are conformed, and the leading-out terminals 2 and the connecting terminals 5 are bonded through heating and pressing from the rear side of the FPC 4. Accordingly, spaces among each terminal 2, 5 are kept without disturbing the conduction of the terminal sections 2, 5, thus preventing short circuits due to the outflow of solder 3 from adjacent terminal sections. |
