| 摘要 |
<p>PURPOSE:To ease automatic mounting while mounting efficiency of a hybrid IC is heightened by extending and forming a plurality of leads from a hole peripheral edge to a hole inside forming an attaching stage part abutted on the peripheral part of a substrate at the edge part of leads while a substrate attaching hole is drilled in the substrate plate. CONSTITUTION:A attaching part 15 at a lead frame 10 is set so as to tightly abut with a wiring substrate 18 mounted. In order that the dimensions of the wiring substrate 18 is approximately the same as difference in level, leads 13 and the wiring substrate 18 are approximately identical at the time of mounting. As the wiring substrate 18 is easily positioned by falling in order that its peripheral part is abutted on the attaching stage part 15 of a frame 11. The wiring substrate 18 mounted on the lead frame 10 can expose mounted chip component 20 on the rear side of the lead frame 10 and both the faces can be mounted without obstructing by mounting.</p> |
