| 摘要 |
<p>PURPOSE:To enhance close adhesion strength by increasing a contact area between a bump electrode and a finger during a mounting operation and to prevent a constitutive material under a bump from being destroyed during the mounting operation by a method wherein a step by an insulating film or the like under a bump electrode layer is formed at the outside of a region of a bump electrode and a flattened structure on the surface of the bump electrode is adopted. CONSTITUTION:The following are provided: a first insulating film 1 formed on a semiconductor substrate; an aluminum electrode 2 formed on the first insulating film 1; a second insulating film 3 formed in such a way that it is extended from the upper part of the first insulating film 1 to the peripheral part on the surface of the aluminum electrode 2; a first metal film layer 4 formed in the central part on the surface of the aluminum electrode 2; a bump electrode layer 5 on the first metal film layer. Alternatively, the following are provided: a first insulating film 1 identical to said film; an aluminum electrode 2; a second insulating film 3; a first metal film layer 4 formed in the central part on the surface of the aluminum electrode 2 and extended on the upper part of the second insulating film 3; and a bump electrode layer 5 formed at the inside of a region where the first metal film layer 4 comes into contact with the aluminum electrode 2 and formed on the first metal layer 4.</p> |
