| 摘要 |
PURPOSE:To increase the life and to improve the reliability of a photodetector by forming a groove having a predetermined shape and depth between a photodetecting part interposed between a pair of electrodes and wire bonding sections on the electrodes. CONSTITUTION:Grooves 5 having a depth arriving at a substrate 2 are formed between the photodetecting part 1A of a compound semiconductor 1 and wire bonding sections 1B. The grooves 5 are formed by etching the semiconductor 1 before electrodes 3 are formed. The depth of the groove 5 is necessarily formed in the degree of the depth of a distortion or a defect generated thereunder by a pressure at the time of wire bonding. After the grooves 5 are formed, electrodes 3 are formed thereon, and bonded to fine metal wirings 4. Thus, the grooves 5 are provided between the semiconductor 1 of the photodetecting part 1A interposed between a pair of electrodes 3 and the bonding section 1B, thereby preventing a distortion or a defect generated in the semiconductor 1 at the time of wire bonding from diffusing in the photodetector 1A. Thus, a photodetector having long life and high reliability can be obtained. |
