发明名称 MANUFACTURE OF SUBSTRATE FOR PRINTED WIRING BOARD
摘要 PURPOSE:To automatize the continuous manufacture of products and enable an effective electrodeposition coating process by causing substrate to be suspensibly held by a conveyor belt one by one, and performing the electrodeposition coating pretreatment process, electrodeposition coating process and electrodeposition coating post-treatment process while allowing the substrates to continuously pass through these processes. CONSTITUTION:Substrates 2 conveyed to an electrodeposition coating pretreatment section 3 undergoe the electrodeposition coating pretreatments such as degresing and pre-rising. Since the substrates 1 are suspensibly held by a conveyor belt one by one, these pretreatments can be performed by a spray method wherein a degreasing liquid, normal water and pure water are sprayed on both sides of the substrates 2 while they are conveyed in the conveyance direction. And the substrates 2 conveyed to an electrodeposition coating process section 4 are dipped in the electrodeposition liquid in an electrodeposition bath 41 and subjected to electrodeposition coating. Also, by performing electrodeposition coating while conveying the substrates 2 in the electrodeposition bath 41, the air bubbles in both sides of the substrates 2 and in the throughholes are effectively removed, whereby the occurrence of electrodeposition failure is prevented. And, the substrates 2 conveyed to an electrodeposition coating post- treatment section 5 after the electrodeposition coating are subjected to the electrodepositon coating post-treatments such as recovery rinsing and post-rinsing.
申请公布号 JPH01120888(A) 申请公布日期 1989.05.12
申请号 JP19870278684 申请日期 1987.11.04
申请人 UBE IND LTD;MEIKO DENSHI KOGYO KK 发明人 YASUNO HIROSHI;SAKATANI SHIRO;KANDA TAKESHI
分类号 H05K3/06;H05K3/00 主分类号 H05K3/06
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