发明名称 MANUFACTURE OF SUPERCONDUCTING MULTILAYER INTERCONNECTION SUBSTRATE
摘要 PURPOSE:To prevent the over etching of the ground layer by patterning an oxide superconductor on the substrate or on the ground layer, thereafter stacking an insulating layer on the whole surface, and lifting off the insulating layer on the superconducting layer. CONSTITUTION:The superconducting critical temperature of the oxide superconductor used as a superconductor containing one or more elements selected from the group IIa, one or more elements selected from the group IIIa or the lanthanide system and Cu can be made higher than the liquid nitrogen temperature. As the coolant, liquid nitrogen which is less expensive than liquid helium may be used. An etching stopper layer 3 functions to protect an n-th superconductor layer 1 from being etched by an etchant when an (n+1)-th superconductor layer 4 is etched by the etchant. Also, by making the pattern of the etching stopper layer 3 into a pattern obtained by removing the portion overlapping with the wiring pattern of the (n+1)-th superconductor from the wiring pattern of the n-th superconductor, the inter-layer superconducting connection will be enhanced.
申请公布号 JPH01120892(A) 申请公布日期 1989.05.12
申请号 JP19870277403 申请日期 1987.11.04
申请人 HITACHI LTD 发明人 SOWA TAKAYOSHI;ISADA NAOYA
分类号 H01L21/306;H01L23/52;H01L23/538;H01L39/24;H05K3/46 主分类号 H01L21/306
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