Cold plate for dissipating heat losses from large-scale-integrated electronic chips

摘要

The invention relates to a cold plate for dissipating heat losses from large-scale-integrated electronic chips, into which meandering pipelines (cooling serpentine coils) are cast through which the coolant flows and which have points which cause turbulence. Such cooling serpentine coils have until now been produced from metal tubing. In consequence, the radius of curvature is limited and production is also complicated. For simplification, the invention proposes the use of a metal corrugated hose as the cooling serpentine coil. In consequence, the cooling serpentine coil now consists of only one part and the heat-dissipating surface of the meandering pipeline is at the same time considerably enlarged, so that, in consequence, manufacture is simplified and the cooling effect is enhanced. <IMAGE>