| 摘要 |
<p>PURPOSE:To improve a thermal fatigue resistance characteristic by fixedly bonding a semiconductor chip to an electrode member by a Pb-Sn-Bi alloy solder which is of special composition and whose melting point is at least 300 deg.C. CONSTITUTION:A solder pellet 2, a semiconductor chip 3, a solder pellet 4, and a lead electrode member 5 are sequentially stacked on a supporting electrode member 1. The solder pellets 2, 4 are a Pb-Sn-Bi solder whose composition is 95wt.% of Pb, 0.5-3.5wt.% of Sn, and 0.5-3.0wt.% of Bi and whose melting point is in the range of 310-320 deg.C. They are thermally treated at about 350 deg.C in the hydrogen gas atmosphere and a resin sealing body made up of silicon rubber is charged to complete a diode for power applications. Such diode presents an excellent thermal fatigue characteristic in high temperature fatigue tests with intermittent conduction.</p> |
