| 摘要 |
PURPOSE:To prevent the peeling of a film and the crack of a substrate in a photosensitive material at the time of working and assembling by specifying the heating temp. of said material in a preliminary heating step and the developing time of the material in a subsequent developing step. CONSTITUTION:The photosensitive material is heated at the temp. of 65-120 deg.C in the preliminary heating step, and then, developed for 10-100min in the subsequent developing step. When the temp. of the preliminary heating step is <65 deg.C, the standing up in the edge part of a pattern after developing is not sharp, and the variance in pattern width occurs, resulting in failures. On the other hand, when said temp. is >120 deg.C, the difference of the developing speed between the exposed part and the unexposed part of said material is lessened, therefore the pattern is not formed. When the developing time is <10min, even when the preliminary heating temp. is set to 65 deg.C to obtain a prescribed film thickness, the unexposed part of said material can not be completely developed. On the other hand, when the preliminary heating temp. is set to 120 deg.C, and the developing time exceeding >100min to obtain a prescribed taper angle, the resin film in the exposed part disappears, and the prescribed pattern is not obtd. thus, the peeling of the film and the crack of the substrate plate at the time of working and assembling of said material are prevented. |
